I am placing a punch into a terminal that I'm modeling, inorder to create a dimple. The punch I'm inserting is basically a half-sphere shaped punch. After placing the assembly constraints for the punch, I of course have to define the Boundary Plane and the Seed Surface. Since I have no planer surface with regards to the Seed Surface due to the fact it's a sphere, the only way I know around this, is to create a very small miniscule flat on the punch to compensate for the Seed Surface....Can anyone suggest another method to get around this????
(wooh!! apologies for the long explanation
(wooh!! apologies for the long explanation